JUKI SMT Bracket IC Pallet BGA Bulk Material Pallet JUKIIC Pallet
JUKI SMT Bracket IC Pallet BGA Bulk Material Pallet JUKIIC Pallet JUKI SMT Bracket IC Pallet BGA Bulk Material Pallet JUKIIC Pallet Supply of Panasonic Feida non-magnetic gasket KXFA1 PS QA 01 JUKI thimble ......
Shenzhen CN Technology Co. Ltd..
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10 Layer PCB Printed Circuit Board Bga Fr4 Material 0.08mm MIN Solder Mask Bridge
Applications: Communications Traditional telecommunication equipment, FTTP, VOIP, multimedia services, data networking and IT infrastructure products, wireless infrastructure products, power amplifiers, splitters and combiners, high power transistors, etc.......
Ping You Industrial Co.,Ltd
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10 Layer PCB Printed Circuit Board Bga Fr4 Material 0.08mm MIN Solder Mask Bridge
Applications: Communications Traditional telecommunication equipment, FTTP, VOIP, multimedia services, data networking and IT infrastructure products, wireless infrastructure products, power amplifiers, splitters and combiners, high power transistors, etc.......
Ping You Industrial Co.,Ltd
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BGA X Ray Inspection Machine , Pcb X Ray Inspection System Counting Devices
... all the resistance-type materials and IC materials; through the use of X-RAY imaging of the production materials and access to image information, R & D of the image algorithm calculation, access to the actual number of materials, while the number of...
Unicomp Technology
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BT material BGA semiconductor package Substrate production
All types BGA of memory substrate manufacture China Application:Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,Semiconductor package; Short introduction of Horexs Manufacturer: HOREXS-Hubei is belong to HOREXS Group, is one ......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials
BGA Chips 198PCS Custom Jedec Trays Heat Proof MPPO Materials Customized Reusable High Temperature Anti-Static Holder For BGA Chips Jedec trays is a standard-defined tray for transporting, handling, and storing complete chips and other components,and the ......
Shenzhen Hiner Technology Co.,LTD
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Intel AMD Compatible CPU Aluminum Copper Pipe Heat Sinks For BGA Industrial
...BGA industrial application Quick Details: Precision Copper Pipe Heat SInk Aluminum Fin Heat Sink with Copper Pipe Materials: Pure Copper C1100 Strips, Purity over 99.5% Depend on customer's requirements Description: Aluminum Fin Heat Sink with Copper Pipe 300W Big Power Copper Pipe Heat Sink Copper Pipe Heat Sink for Stage Lamp Heat Sink With Copper Pipe For Stage Lamp Application: Stage Lamp,BGA......
LiFong(HK) Industrial Co.,Limited
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BGA 4 layers 1.6mm PCB Manufacturer FR4 1oz ENIG Electronic Printed Circuit Board
...BGA Detail Specifications: Layers4 Material FR-4 Board Thickness 1.6mm Copper Thickness 1oz Surface Treatment ENIG Soldmask & Silkscreen Green & White Quality Standard IPC Class 2, 100% E-testing Certificates TS16949, ISO9001, UL, RoHS 4 layers 1.6mm FR4 1oz ENIG Electronic Printed Circuit Board with BGA......
Shenzhen KAZ Circuit Co., Ltd
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Small BGA Multilayer Printed Circuit Board 6 Layer 3mil Immersion Gold
Small BGA Multilayer Printed Circuit Board 6 Layer 3mil Immersion Gold Multilayer Printed Circuit Board Halogen Free Material Small BGA Small Line Space And Gap Multilayer PCB 6L Halogen Free Printed Circuit Board Max layers: 32layer (≥20 layer needs to ......
Huashengxin Circuit Limited
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5 Work Modes Stepping Motor CCD Color Optical Alignment System Mobile Phone BGA Rework Station
...tem Mobile Phone BGA Rework Station Specification Mobile Phone BGA Rework Station Model:HS-700 Power Supply AC 100V / 220V±10% 50/60Hz Total power 2600W Heater power Top heater 1200W(Max), bottom heater 1200W(Max) Electric material Driving motor + ......
Shenzhen Hansome Technology Co., Ltd.
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