Categories | Double Layer PCB |
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Place of Origin: | Shenzhen, China |
Brand Name: | WonDa |
Packaging Details: | Vacuum bag + Outer carton |
Number of Layers: | double layer PCB |
Base Material: | FR4 TG150 |
Copper Thickness: | 1/1OZ |
Board Thickness: | 1.6mm |
Min. Hole Size: | 0.35mm |
Min. Line Width: | 12mil |
Min. Line Spacing: | 16mil |
Surface Finishing: | OSP |
solder mask color: | green |
silkscreen color: | white |
Certification: | CE, ROHS, UL |
MOQ: | None |
Price: | Negotiable |
Delivery Time: | 5-15 days |
Payment Terms: | T/T, W.U, L/C |
Supply Ability: | 10000 Sq.meter/month |
Company Info. |
Shenzhen WonDa Technology Co., Ltd. |
Verified Supplier |
View Contact Details |
Product List |
NO MOQ
1.2 layers PCB with OSP
2.Base material: FR-4 based with TG150
3.Board thickness:1.6mm
4.Copper thickness:1 OZ
5.Min line width :12mil
6.Min line spacing: 16mil
7.soldermask color: green
8.low price and good quality.
9.4-7days small order;8-15days mass order
10.ISO9001, UL, ROHS,SGS complianted
UL:E320045
ROHS: A001C100827049001-2
SGS: CANEC1000312001
ISO9001:2000:110801011
With 12 years experience We can do for you:
1-16 layer FR-4 PCB board, 1-2 layer Aluminum PCB
1-6 oz copper thickness
0.2 mm hole size
0.1 mm line width/space
Our PCBs are used for wide range of electronic products,
Like Inverter, Medical devices, CCTV, Power supply, GPS, UPS, Set-top Box, Telecomunication ,LED, etc.
Our Factory Manufacture Capability
Item | Manufacture Capability |
Material | FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based |
Layer No. | 1-16 |
Finished Board thickness | 0.2 mm-3.8mm’(8 mil-150 mil) |
Board Thickness Tolerance | ±10% |
Cooper thickness | 0.5 OZ-6OZ (18 um-210 um) |
Copper Plating Hole | 18-40 um |
Impedance Control | ±10% |
Warp&Twist | 0.70% |
Peelable | 0.012"(0.3mm)-0.02’(0.5mm) |
Images | |
Min Trace Width (a) | 0.1mm (4mil) |
Min Space Width (b) | 0.1mm (4 mil) |
Min Annular Ring | 0.1mm (4 mil) |
SMD Pitch (a) | 0.2 mm(8 mil) |
BGA Pitch (b) | 0.2 mm (8 mil) |
0.05mm | |
Solder Mask | |
Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) |
Soldermask Clearance (b) | 0.1mm (4 mil) |
Min SMT Pad spacing (c) | 0.1mm (4 mil) |
Solder Mask Thickness | 0.0007"(0.018mm) |
Holes | |
Min Hole size (CNC) | 0.2 mm (8 mil) |
Min Punch Hole Size | 0.9 mm (35 mil) |
Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm |
Hole Position Tol | ±0.075mm |
Plating | |
HASL | 2.5um |
Lead free HASL | 2.5um |
Immersion Gold | Nickel 3-7um Au:1-5u'' |
OSP | 0.2-0.5um |
Outline | |
Panel Outline Tol (+/-) | CNC: ±0.125mm, Punching: ±0.15mm |
Beveling | 30°45° |
Gold Finger angle | 15° 30° 45° 60° |
Certificate | ROHS, ISO9001:2008, SGS, UL certificate |