ENEPIG semiconductor assembly BGA Substrate Hitachi BT raw material
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Application:FC package substrate,FlipChip substrate,Flipchip CSP,.FBGA/LGA/PBGA/WBGA substrate;IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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8 Layer BGA Boards Multilayer PCB Board Fr4 Fr5 Substrate Blue Solder Mask
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... Board size:2*6CM Solder mask:Blue Silk screen: White Name: 8 Layer BGA Boards Multilayer PCB With Blue Solder Mask Delivery time: 10days for sample and small&medium batch About quote:For the special of ......
ONESEINE TECHNOLOGY CO.,LTD
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High Definition Industrial Touch Screen BGA rework station HS-700
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...BGA's full name is BallGridArray, it is in the bottom edge of the package body substrate to make an array of solder ball as the I/O end of the circuit and the printed circuit board (PCB) interconnection.BGA is a class of chip packaging technology, rework BGA chip machine and equipment is called the BGA......
Shenzhen Hansome Technology Co., Ltd.
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BGA FR4 PCB Multilayer / Immersion Gold PCB Board Programmable
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... of the substrate (Copper-Clad Laminate copper clad substrate) (in KB-6160 (the most commonly used FR-4 plate), for example) Yellow and white core plate divided core material, usually ......
Shenzhen Xinchenger Electronic Co.,Ltd
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PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold
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... General description This is a type of 10-layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on...
Bicheng Electronics Technology Co., Ltd
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PCB with Ball Grid Array 10-Layer BGA PCB Built On High Tg FR-4 With Immersion Gold
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... General description This is a type of 10-layer printed circuit board built on FR-4 Tg170 substrate for the application of PLC controls. It's 2.0 mm thick with white silkscreen on green solder mask and immersion gold on pads. A BGA package is placed on...
Shenzhen Bicheng Electronics Technology Co., Ltd
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Cycling Rapid Rate TSA BGA Thermal Shock Chamber Testing
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... components, metal, chemical materials, automation components, communication module, national defense industry, aerospace industry, BGA, PCB substrate, electronic chip IC, semiconductor ceramic and high polymer materials. Characteristics: 1. Short...
BOTO GROUP LTD
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Electricity Circuit Component BOM Turnkey PCB Assembly BGA X Ray Inspection
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...is a circuit board that forms point-to-point connections and printed components on a common substrate according to a predetermined design. Printed circuit boards are an indispensable basic component of electronic information products and are known as "the...
Chengdu Cesgate Technology Co., Ltd
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6oz Pcb Smt Assembly Fr4 Hasl Qfn Bga Dip Rigid
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...BGA DIP Rigid PCB Assembly PCB SMT Assembly Introduction Haina Lean Technology CO., LTD is our factory. We build amazing electronics. From prototype to production, we are entrusted to be their electronic manufacturing partner by companies small and large around the world. PCBA CAPABILITIES Layers 1 - 46 L Substrate......
Beijing Haina Lean Technology Co., Ltd
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IBE SMT BGA PCB Assembly Flash Gold Finger For Electric Power Equipment
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... circuit boards. The traces or conductive pathways engraved in the laminated copper sheets of PCBs are used within a non-conductive substrate in order to form the assembly.SMT Assembly, BGA Assembly, Through-Hole Assembly, Mixed Assembly, Rigid Flex PCB...
IBE ELectronics Co.,LTD
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