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40mm 0 2mm Wafer Dicing Blade

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40mm 0 2mm wafer dicing blade

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Wholesale Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade from china suppliers

Semiconductor Diamond Saw Blades , 0.2mm Wafer Dicing Blade

Brand Name:TONGYU INDUSTY

Model Number:RTR1A8-006

Place of Origin:CHINA

0.2MM Thick Ultrathin Resin Bonded Diamond Dicing Blade for High Precision Cutting Super Hard Material Cutting Tools, also called Dicing Wheel or Saw Blade Sample blade specification: 58*40*0.2mm ( D * H * T) We use resin powder to increase the flexibility...

Shaanxi Tongyu Industry And Trade Co,.Ltd
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