hydrophilic bonding wafer bonder machine

Brand Name:ZMSH

Model Number:Wafer bonder equipment

Place of Origin:China

...silicon carbide (SiC) wafers, supporting both room temperature bonding and hydrophilic bonding techniques. It is capable of handling wafers of 4-inch, 6-inch, 8-inch, and 12-inch sizes, and is optimized for SiC-to-Si and SiC-to-SiC bonding applications.

Brand Name:ASM

Model Number:NANO

Place of Origin:China

...Machine Die Bonder And Flip Chip Bonder Machine ASM NANO Die Bonder and Flip Chip Bonder, Original and Used Die Bonder and Flip Chip Bonder Machine Infinite Automation is the best choice if you are looking for dependable Factory Automation Machines and Production Equipment. Among Our offered machines are original and pre-owned Die Bonding and Die Attach, Wire Bonding, Die Bonder and Flip Chip Bonder Machines...

Brand Name:ZMSH

Model Number:Wafer Bonding Equipment

Place of Origin:CHINA

Wafer Bonding Equipment Room Temperature Bondin Hydrophilic Bonding Si-SiC Si-Si Bonding 2 -12 inch Wafer Bonding System Overview Wafer Bonding Equipment is a high-end bonding equipment specifically designed for silicon carbide (SiC) power device manufacturing, supporting 2 to 12-inch wafer specifications. Wafer Bonding Equipment incorporates advanced room-temperature direct bonding and surface-activated bonding...

Place of Origin:china

Brand Name:sunsom

Model Number: XCM71 - A6

TFT FPD Repair Bonder Machine 1、 About the application field of TFT FPD Repair Bonder machine equipment XCM71 - A6 TFT FPD Repair Bonder machine is widely used in a variety of LCD and the large size of display panel's production and maintenance; such as: ...

Place of Origin:Dongguan China

Brand Name:SMTfly

Model Number:CWPC-1A

... precision, the load evenly, to eliminate internal stress 2. Safe, easy to operate 3. Electronic component won't short circuit Specification: welding machine 1.

Brand Name:Suneast

Model Number:CBD2200 EVO

Place of Origin:Shenzhen, Guangdong Province, China

Productive High Speed Small footprint IC Bonder CBD2200 EVO Modular Platform Design Features: High speed, accurate solidification capacity ±10um@3σ; High production efficiency, low cost input High multi-chip processing capacity, support 16 different types...

Brand Name:MENTO

Place of Origin:Dongguan,China

Model Number:M2020

Model M20 Series Mini LED appearance inspection M2020 Inspection Inspection items Missed bonding, wrong bonding, die damaged, die offset, die tilted, die flipped, wrong polarity, particles, die lift-off, poor collinearity Inspection method Image processing...

Brand Name:WZ

Model Number:WZ-GX01

Place of Origin:China

...Bonder/die Bonding Machine / Die Attach Die BonderDie Bonder Suitable for: SMD HIGH-POWER COB,part COM in-line package etc. 1,Full automatic up load and down load materials. 2,Module design,max optimization structure. 3,Full intellectual property right. 4,Picking die and Bonding die dual PR system. 5,Multi-wafer ring,dual glue ect configuration. Wafer Stage System The wafer...

Model Number:616DH

Place of Origin:China

Brand Name:CHUANGLIYOU

...Bonding LCD Repair Machine LCD Bonding Machine The LCD Repair Bonding Machine is also known as Pulse Heat Bonding Machine, Pulse Heat Hot Bar Machine, and ACF (Anisotropic Conductive Film) Bonder, which can be used on LCD ACF/COF/TAB repair. It is most common machine on LCD repair process, can re-bond or replace new COF/TAB. Model NO. 616DH Use LCD Screen Repair Tab Bonding Other Name LCD Repair Bonding Machine

Brand Name:Dongho

Model Number:TH-M2060

Place of Origin:China

... with 3.6kW and 6.0kW ultrasonic generators. The ultrasonic generator for the system belongs to the ultrasonic digital one, which can communicate between the power box and controller to digitally input all bonding parameters. Many

Brand Name:Onetop

Model Number:ONT-WB938

Place of Origin:SHENZHEN,CHINA

High Quality Automatic ultrasonic wire bonder for battery pack Equipment basic working principle: After the module assembly process is completed, the equipment is used to automatically load the system, and then sent to the welding area through the ...

Brand Name:Chuangwei

Model Number:CW-2A2P

Place of Origin:China

...Machine with Smart Thermode,FPC Hotbar Bonder,FFC Hotbar Welding CW-2A2B: Fpc Pulse Heat Bonding-the Result of Flexible Circuit Board Hotbar Soldering Pulse Heat Hot-bar Soldering,CW-2A2B Specification: 1. Customized based on the connector 2. Double jig welding 3. Double- desk working mode 4. Can achieve ultra-fine pitch welding 5.Applicable to welding the cable and connection of communicating machine...

Brand Name:AWT

Model Number:EV-3740A

Place of Origin:CHINA

Main application: 18650,26800, 32700,Prismatic lithium battery wire bonding. Advantage: 1,First wire bonding machine using rotary bonding head in China . 2,Digital & automatic frequency tracking ultrasonic system. 3,Digital pressure adjustment system. 4,W...

Brand Name:FUNSONIC

Model Number:FS620

Place of Origin:CHINA

Ultrasonic Semiconductor Wafer Coating Description: Wafer coating is a unique process that facilitates the automatic application of chip bonding adhesives at the wafer level, followed by the formation of chip bonding films in the next stage. FUNSONIC's ...

Brand Name:YL

Model Number:YCB-15

Place of Origin:China

... Contactless Card Chip Bonding Machine/RFID Card INLAY Sheet Chip Antenna Bonder/Automatic RFID Card Chip Welding Machine YCB-18 The machine is designed for bonding or welding the contactless card antennas and chips together in an automatic and speedy way.

Brand Name:BonTek

Model Number:Fused Silica, Fused Quartz

Place of Origin:China

...Wafer and BF33 C7980 BK7 H-K9L Glass Wafers The glass wafers are widely used as bonding material with silicon wafers in semiconductor industry. BonTek provides Borofloat 33 (BF33) glass wafers with very good surface quality. TTV could be as low as 1.5um to 5um, Bow/Warp as 7um, Ra 0.5nm depending on the wafer diameter. We possess the wire saw, grind and polish machines, laser marking machine...

Brand Name:SMTfly

Model Number:SMTfly-PC1A

Place of Origin:China

Optional CCD Hot Bar Soldering Machine for Soldering FPC to PCB,SMTfly-PC1A Feature: Extremely short cycle time with rotary table design Product loading and unloading can be done during the heat sealing process High quality heat seal application up to 0....

Brand Name:Bird UV

Model Number:BTW200

Place of Origin:Guangdong, China

...wafer oven UV LED wafer debonder machine wafer debonding Adhesive Peeling dessolver equipment Type: UV Lamp Light Power Intensity: 1-20W/cm2 Weight: 10 KG Power: 550w Warranty: 1 Year Cooling Method: Air Cooling Wavelength: 365nm Size: 366*158*360mm/customized Control Method: ON/OFF,PLC Selling Units: Single Item Product Application UV Printing,UV Glue,UV Adhesive,UV Bonding...

Brand Name:Aitop

Model Number:AITOP-830

Place of Origin:CHINA

Hot sale electric car battery pack ultrasonic aluminum wire bonding machine Equipment basic working principle: After the module assembly process is completed, the equipment is used to automatically load the system, and then sent to the welding area through...

Brand Name:HT

Model Number:HT-WSB

Place of Origin:China

... using new electroforming technology. These blades are widely used for dicing semiconductor wafers, resistance, ceramics, semiconductor encapsulating materials and more. For more information about these super abrasive dicing blades and machining tools,