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ISO Single Side Printed Circuit Board Assembly PCB Fabrication

Categories Turnkey PCB Assembly
Brand Name: HUASWIN
Model Number: HSPCBA1661
Certification: ISO/UL/RoHS
Place of Origin: China
MOQ: 1 sets
Price: Negotiation
Payment Terms: T/T, Western Union, L/C
Supply Ability: 10,000pcs per month
Delivery Time: 15-20 working days
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
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ISO Single Side Printed Circuit Board Assembly PCB Fabrication


ISO PCB Single Side Turnkey PCB Assembly Manufacturer


Specifications


1. Electronics PCB and PCB assembly manufacturer
2. UL,RoHS,SGS, ISO Approved
3. Reliable OEM / ODM PCB assembly
4. High Quality, fast delivery

5. Best after-sales service


PCB capability and services:


1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)

2. Flexible PCB (up to 10 layers)

3. Rigid-flex PCB (up to 8 layers)

4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test


Detailed Specification of PCB Manufacturing


1

layer

1-30 layer

2

Material

CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based

material.

3

Board thickness

0.2mm-6mm

4

Max.finished board size

800*508mm

5

Min.drilled hole size

0.25mm

6

min.line width

0.075mm(3mil)

7

min.line spacing

0.075mm(3mil)

8

Surface finish

HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold,

OSP

9

Copper thickness

0.5-4.0oz

10

Solder mask color

green/black/white/red/blue/yellow

11

Inner packing

Vacuum packing,Plastic bag

12

Outer packing

standard carton packing

13

Hole tolerance

PTH:±0.076,NTPH:±0.05

14

Certificate

UL,ISO9001,ISO14001,ROHS,TS16949

15

Profiling punching

Routing,V-CUT,Beveling



PCB Assembly services:


SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection

Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering

Material Sourcing
IC pre-programming / Burning on-line

Function testing as requested

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design


Testing Methods

AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by

component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing


Factory view:


Quality ISO Single Side Printed Circuit Board Assembly PCB Fabrication for sale
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