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Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc

Categories Thermal Gap Pad
Brand Name: ZIITEK
Model Number: TIF™500S Series
Certification: UL and RoHs
Place of Origin: China
MOQ: 1000pcs
Price: negotiation
Supply Ability: 100000pcs/day
Delivery Time: 3-5 work days
Packaging Details: 1000pcs/bag
Construction & Compostion: Ceramic filled silicone rubber
Thermal conductivity: 3.0W/m-K
Hardness: 40 Shore 00
Specific Gravity: 2.64 g/cc
Continuos Use Temp: -50 to 200℃
Dielectric Breakdown Voltage: >10000 VAC
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Compressible CPU silicone Thermal conductive Pad TIF™500S Series, Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc

Compressible CPU Thermal Pad for High Speed Mass Storage Drives Blue 5.5 MHz Dielectric Constant

The TIF™500S Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features

> Good thermal conductive: 3.0 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
Typical Properties of TIF™500S Series
Color

Blue

VisualComposite ThicknesshermalImpedance
@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***10mils / 0.254 mm0.36
20mils / 0.508 mm0.41
Specific Gravity
2.64 g/ccASTM D297

30mils / 0.762 mm

0.47

40mils / 1.016 mm

0.52
Heat Capacity
1 l /g-KASTM C351

50mils / 1.270 mm

0.58

60mils / 1.524 mm

0.65

Hardness
40 Shore 00ASTM 2240

70mils / 1.778 mm

0.72

80mils / 2.032 mm

0.79
Tensile Strength

45 psi

ASTM D412

90mils / 2.286 mm

0.87

100mils / 2.540 mm

0.94
Continuos Use Temp
-50 to 200℃

***

110mils / 2.794 mm

1.01

120mils / 3.048 mm

1.09
Dielectric Breakdown Voltage
>10000 VACASTM D149

130mils / 3.302mm

1.17

140mils / 3.556 mm

1.24
Dielectric Constant
5.5 MHzASTM D150

150mils / 3.810 mm

1.34

160mils / 4.064 mm

1.42
Volume Resistivity
7.8X10" Ohm-meterASTM D257

170mils / 4.318 mm

1.50

180mils / 4.572 mm

1.60
Fire rating
94 V0

equivalent UL

190mils / 4.826 mm

1.68

200mils / 5.080 mm

1.77
Thermal conductivity
3.0 W/m-KASTM D5470Visua l/ ASTM D751ASTM D5470

Standard Thicknesses:


0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)


Consult the factory to alternate thickness.


Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.


Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.


Advantage


Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

Quality Compressible CPU silicone Thermal conductive Pad TIF™500S Series,  Blue 5.5 MHz Dielectric Constant, 3.0 W/mK 2.64 g/cc for sale
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