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4 Layer 0.4mm FR4 PCB Board with Immersion Silver For Security Systems

Categories FR4 PCB Board
Brand Name: Bicheng
Model Number: BIC-469.V1.0
Certification: UL, ISO9001, IATF16949
Place of Origin: CHINA
MOQ: 1PCS
Price: USD9.99-99.99
Payment Terms: T/T
Supply Ability: 5000PCS per month
Delivery Time: 8-9 working days
Packaging Details: Vacuum bags+Cartons
Base material: FR-4
Layer count: 4 Layers
PCB thickness: 0.5mm ±0.1
PCB size: 111 x 45mm=1PCS
Solder mask: Green
Silkscreen: White
Copper weight: 1oz
Surface finish: Immersion Silver
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4 Layer 0.4mm FR4 PCB Board with Immersion Silver For Security Systems

Immersion Silver PCB on 0.4mm FR-4 ITEQ 4 Layer Circuit Board for Security Systems
1.1 General description
This is a type of 4 layer printed circuit board built on FR-4 substrate with mid-Tg 150°C for the application of Security Systems. It's only 0.4 mm thick with white silkscreen(Taiyo) on green solder mask (Nanya) and immersion silver on pads. The base material is from Taiwan ITEQ supplying 1 up PCB per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 30 boards are packed for shipment.
1.2 Features and benifits
Very Low Moisure Absorption and better CAF resistance
Good solderability
16000 square meter workshop
Meeting your PCB needs from prototype to mass production.
UL recognized and RoHS Directive-compliant
Customer complaint rate: <1%
1.3 Applications
Medium Access Control
Speaker System
Broadband Modem
Vfd Drive
Module GSM
Gate Access Control
1.4 Parameter and data sheet
PCB SIZE111 x 45mm=1PCS
BOARD TYPEMultilayer PCB
Number of Layers4 Layers
Surface Mount ComponentsYES
Through Hole ComponentsYES
LAYER STACKUPcopper ------- 18um(0.5oz)+plate TOP layer
PP 2116 x 1
copper ------- 18um(0.5oz)
FR-4 0.1mm
copper ------- 18um(0.5oz)
PP 2116 x 1
copper ------- 18um(0.5oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:6.99mil/8.47mil
Minimum / Maximum Holes:0.399mm/3.556mm
Number of Different Holes:7
Number of Drill Holes:1521
Number of Milled Slots:0
Number of Internal Cutouts:0
Impedance Controlno
BOARD MATERIAL
Glass Epoxy:FR-4, ITEQ IT-158, Tg>150 °C
Final foil external:1oz
Final foil internal:0.5oz
Final height of PCB:0.5mm ±0.1
PLATING AND COATING
Surface FinishImmersion Silver, Ag>0.15µm
Solder Mask Apply To:Top and Bottom, 12micon Minimum.
Solder Mask Color:Green, LP-4G G-05, Nanya supplied
Solder Mask Type:LPSM
CONTOUR/CUTTINGRouting
MARKING
Side of Component LegendTOP
Colour of Component LegendWhite, S-380W, Taiyo Supplied.
Manufacturer Name or Logo:Marked on the board in a conductor and leged FREE AREA
VIAPlated Through Hole(PTH), via tented.
FLAMIBILITY RATINGUL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:0.0059" (0.15mm)
Board plating:0.0030" (0.076mm)
Drill tolerance:0.002" (0.05mm)
TEST100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIEDemail file, Gerber RS-274-X, PCBDOC etc
SERVICE AREAWorldwide, Globally.
1.5 ITEQ Laminate/ Prepreg : IT-140TC / IT-140BS
PropertyThickness<0.50 mmThickness≧0.50 mmUnitsTest Method
[0.0197 in][0.0197 in]
Typical ValueSpecTypical ValueSpecMetricIPC-TM-650
(English)(or as noted)
Peel Strength, minimumN/mm2.4.8
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil](lb/inch)2.4.8.2
B. Standard profile copper foil0.96 (5.5)0.70 (4.0)0.96 (5.5)0.70 (4.0)2.4.8.3
1. After Thermal Stress
2. At 125°C [257 F]
3. After Process Solutions1.75 (10 )0.80 (4.57)1.93 (11.0)1.05 (6.00)
1.66 (9.5)0.70 (4.00)1.66 (9.5)0.70 (4.00)
1.49 (8.5)0.55 (3.14)1.49 (8.5)0.80 (4.57)
Volume Resistivity, minimumMW-cm2.5.17.1
A. C-96/35/905x1010106----
B. After moisture resistance----5x1010104
C. At elevated temperature E-24/1255x10101035x1010103
Surface Resistivity, minimumMW2.5.17.1
A. C-96/35/903.5x1010104----
B. After moisture resistance----3.5x1010104
C. At elevated temperature E-24/1256x10101036x1010103
Moisture Absorption, maximum0.3--0.10.8%2.6.2.1
Dielectric Breakdown, minimum----6040kV2.5.6
Permittivity (Dk, 50% resin content)4.65.44.65.4--2.5.5.9
(Laminate & Laminated Prepreg)
A. 1MHz
Loss Tangent (Df, 50% resin content)0.0160.0350.0160.035--2.5.5.9
(Laminate & Laminated Prepreg)
A. 1MHz
Flexural Strength, minimumN/mm22.4.4
A. Length direction----500-530415(lb/in2)
----(72,500-76,850)-60,190
B. Cross direction----430-460345
----(62,350-66,700)-50,140
Arc Resistance, minimum1206012060s2.5.1
Thermal Stress 10 s at 288°C [550.4F],minimumRating2.4.13.1
A. UnetchedPassPass VisualPassPass Visual
B. EtchedPassPass VisualPassPass Visual
Electric Strength, minimum4530----kV/mm2.5.6.2
(Laminate & Laminated Prepreg)
Flammability,V-0V-0V-0V-0RatingUL94
(Laminate & Laminated Prepreg)
Glass Transition Temperature(DSC)140135 minimum140135 minimum˚C2.4.25
Decomposition Temperature----305--˚C2.4.24.6
(5% wt loss)
Z-Axis CTE2.4.24
A. Alpha 1----55--ppm/˚C
B. Alpha 2----290--ppm/˚C
C. 50 to 260 Degrees C----4.2--%
Thermal Resistance2.4.24.1
A. T260----15--Minutes
B. T288----2--Minutes
CAF Resistance----PassAABUSPass/Fail2.6.25

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