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Ball Grid Array Bom Pcb Assembly With AOI ICT 100% Visual Inspection

Categories New Energy PCB Assembly
Brand Name: Suntek
Model Number: FPA8569-NE4
Place of Origin: China
Certification: ISO9001, ISO13485, TS16949 and UL E476377
MOQ: 5pcs
Price: USD+1-100+PCS
Payment Terms: T/T,Paypal
Supply Ability: 100pcs/hour
Delivery Time: 3-6 weeks
Packaging Details: cartons and ESD bags
Minimum Hole Size: 0.2mm
Layers: 2-20 Layers
Maximum Copper Weight: 6oz
Application: Electric Vehicles, Renewable Energy Systems, Energy Storage Systems
Lead Time: 3-5 Days after all components collected
Testing: AOI,ICT,100% Visual Inspection,FT
Type: Printed Circuit Board Assembly
Minimum Trace/Space: 4mil/4mil
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Ball Grid Array Bom Pcb Assembly With AOI ICT 100% Visual Inspection

New Energy PCB Assembly with AOI,ICT,100% Visual Inspection,FT

SMT Parameters:

Technology Involved:


Special Technology Involved

◆ IC Programming

◆ BGA rework

◆ Chip on Board/COB

◆ Eutectic soldering

◆ Auto-Gluing

◆ Conformal Coating


Assemly Flow Chart:


Suntek Group is a leading supplier in EMS field with one-stop solution for PCB/FPC assembly,Cable assembly,Mix technology assembly and Box-buildings.

Suntek Electronics Co., Ltd,as the major facility, located in Hunan Prov,China;

BLSuntek Electronics Co., Ltd,as the new facility,located in Kandal Prov,Cambodia.With ISO9001:2015,ISO13485:2016,IATF 16949:2016 and UL E476377 certified,.We deliver qualified products with competitive price to clients all over the world.


Quality Ball Grid Array Bom Pcb Assembly With AOI ICT 100% Visual Inspection for sale
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