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Categories | PCB Handling Equipment |
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Brand Name: | HSTECH |
Model Number: | HS-700 |
Certification: | CE |
Place of Origin: | China |
MOQ: | 1 set |
Price: | Negotiable |
Payment Terms: | T/T, Western Union, MoneyGram |
Supply Ability: | 100 sets per month |
Delivery Time: | 7~9 work days |
Packaging Details: | Wooden package |
Product Name: | Mobile Phone BGA Rework Station |
Warranty: | 1 Year |
Control: | Touch screen |
PLC: | MITSUBISHI |
Relay Brand: | Schneider |
Optoelectronic Switch: | OMRON |
Material: | Aluminum Alloy |
Condition: | New |
Thickness: | 0.3 - 5mm |
Signal: | SMEMA |
Application: | Electronic Assembly |
Color: | Silver |
Control System: | PLC |
OEM/ODM: | Available |
Total power: | 2600W |
Power Supply: | AC220V |
Air Pressure: | 4-6bar |
Mounting accuracy: | ±0.01mm |
Type: | Automatic |
Weight: | 30KG |
Company Info. |
Shenzhen Hansome Technology Co., Ltd. |
Verified Supplier |
View Contact Details |
Product List |
Smart Temperature Control PCB Handling Equipment for Mobile Phone Repair
Specification
Mobile Phone BGA Rework Station | Model:HS-700 |
Power Supply | AC 100V / 220V±10% 50/60Hz |
Total power | 2600W |
Heater power | Top heater 1200W(Max), bottom heater 1200W(Max) |
Electric material | Driving motor + smart temp. controller + color touch screen |
Temperature control | high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃) |
Sensor | 1pcs |
Locating way | V shape PCB support + external universal fixture + laser light for centering and positioning |
Overall dimension | L450mm*W470mm*H670mm |
PCB size | Max 140mm*160mm Min 5mm*5mm |
BGA size | Max 50mm*50mm Min 1mm*1mm |
Applicable PCB thickness | 0.3 - 5mm |
Mounting accuracy | ±0.01mm |
Weight of machine | 30KG |
Mount chip weight | 150g |
Working modes | Five: Semi-auto/Manual/Remove/Mount/Weld |
Usage Repair | chips / phone motherboard etc |
Features
1. 5 work modes
2. 15''HD LCD monitor
3. 7''HD color touch screen
4. stepping motor
5. CCD color optical alignment system
6.Temperature accuracy within ±1℃
7.Mounting precision within ±0.01mm
8.Repair success rate: 99% +
9. Independent research and development of single-chip control
About Packaging
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