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Dielectric Constant 4.0 Mhz Cpu Thermal Pad Silicone For Cd-Rom

Categories CPU Thermal Pad
Brand Name: Ziitek
Model Number: TIF1160-30-05US thermal pad
Certification: UL
Place of Origin: China
MOQ: 1000 pcs
Price: 0.1-10 USD/PCS
Payment Terms: T/T
Supply Ability: 100000pcs/month
Delivery Time: 3-8 work days
Packaging Details: 25*24*13cm canton
Certifications: ISO14001
Thermalconductivity: 3.0 W/mK
keyword: Thermal Gap Pad
Application: Routers
color: blue
Name: Dielectric constant 4.0 MHz high cost-effective silicone pads for CD-Rom
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Dielectric Constant 4.0 Mhz Cpu Thermal Pad Silicone For Cd-Rom

Dielectric constant 4.0 MHz high cost-effective silicone pads for CD-Rom


Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


TIF100-30-05US-Series-Datasheet.pdf

TIF1160-30-05US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
<Good thermal conductive:3.0W/mK
<Thickness:4.0mmT
<Hardness:18 Shore 00
<Colour: blue

<UL recognized

<Easy release construction

<Electrically isolating

Applications

<Automotive electronics

<Set top boxes

<Audio and video components

<IT infrastructure

<GPS navigation and other portable devices

<CD-Rom, DVD-Rom cooling


Typical Properties of TIF1160-30-05US
Product Name

TIF1160-30-05US Series

Colour
blue
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

3.0 g/cc

Thickness

4.0mmT
Hardness
18 Shore 00
Dielectric constant@1MHz
4.0 MHz
Continuos Use Temp
-40 to 160℃

Dielectric Breakdown Voltage

>5500 VAC
Thermal conductivity
3.0 W/mK
Volume Resistivity

1.0*1012 Ohm-cm


Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL



Independent R&D team


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